計算工学会

2015.10

日髙功二，小金丸正明，関根智仁，宍戸信之，神谷庄司，三成剛生，池田徹，時任静士 .  有機薄膜トランジスタ用ゲート絶縁層の機械的負荷下でのリーク電流評価とリークパスの推定 .  エレクトロニクス実装学会誌24 ( 6 ) 586 - 594   2021.9有機薄膜トランジスタ用ゲート絶縁層の機械的負荷下でのリーク電流評価とリークパスの推定Reviewed

Nobuyuki Shishido, Yoshiki Setoguchi , Yuto Kumagai , Masaaki Koganemaru, Toru Ikeda, Yutaka Hayama, Noriyuki Miyazaki .  Characterization of plastic and creep behavior in thick aluminum wire for power modules .  Microelectronics Reliability123(2021)   114185   2021.8Characterization of plastic and creep behavior in thick aluminum wire for power modulesReviewed

IBRAHIM Omar, IKEDA Toru, KOGANEMARU Masaaki .  Unified definition of stress intensity factors at a sharp three-dimensional jointed corner .  Transactions of the JSME (in Japanese)87 ( 900 ) 1 - 14   2021.8Reviewed

ABUMI Yuta, IKEDA Toru, KOGANEMARU Masaaki .  Estimating the critical stress intensity factor for an interfacial corner equivalent to an interfacial crack using the molecular statics and cohesive zone model .  Transactions of the JSME (in Japanese)87 ( 899 ) 1 - 14   2021.7Reviewed

ABUMI Yuta, KINOSE Yutaka, KOGA Yuji, IKEDA Toru, KOGANEMARU Masaaki .  Analyses of the Singular Stress Field Around a 3D Jointed Corner of Dissimilar Anisotropic Materials under Thermal Stress .  Journal of the Society of Materials Science, Japan70 ( 5 ) 412 - 419   2021.5Reviewed

Toru Ikeda .  Reliability of jointed interfaces in power modules .    9 ( 5 ) 272 - 279   2020.11Reliability of jointed interfaces in power modulesReviewed

Toru Ikeda .  Relationship between the thickness of adhesive layer and the strength of an adhesive joint .    56 ( 9 ) 374 - 381   2020.9Relationship between the thickness of adhesive layer and the strength of an adhesive jointReviewed

Takumi Sasaki, Atsushi Yanase, Dai Okumura, Yoshiharu Kariya, Masaaki Koganemaru and Toru Ikeda .  Measurements and FEM Analyses of strain distribution in small Sn specimens with few crystal grains .  Materials Transactions60 ( ６ ) 868 - 875   2019.3Measurements and FEM Analyses of strain distribution in small Sn specimens with few crystal grainsReviewed

A Proposal for Strain Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method .  Journal of the Japan Institute of Electronics Packaging22 ( 1 ) 95 - 102   2019.1A Proposal for Strain Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré MethodReviewed

Reliability of Electronic Packaging .  TEST50   5 - 7   2019.1Reliability of Electronic PackagingReviewed

Koganemaru Masaaki, Nagato Sho, Uchino Masakazu, Ikeda Toru .  A Proposal for Strain Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method .  Journal of The Japan Institute of Electronics Packaging22 ( 1 ) 95 - 102   2019Reviewed

Shunsuke KAWASHITA, Yuto NANAZOSHI, Toru IKEDA, Masaaki KOGANEMARU, Hiroaki HOKAZONO, Tatsuhiko ASAI .  Evaluation of the Delimitation of Molding Resin in a Power Module under Thermal Cycle Test .  Journal of smart processing7 ( 4 ) 146 - 153   2018.7Evaluation of the Delimitation of Molding Resin in a Power Module under Thermal Cycle TestReviewed

Mitsutoshi Abe, Toru Ikeda, Masaaki Koganemaru, Noriyuki Miyazaki .  Stress intensity factor analysis of a three-dimensional interfacial corner between anisotropic piezoelectric multi-materials under several boundary conditions on the corner surfaces .  Engineering Fracture Mechanics171   1 - 21   2017.2Stress intensity factor analysis of a three-dimensional interfacial corner between anisotropic piezoelectric multi-materials under several boundary conditions on the corner surfacesReviewed

Yuji Koga, Yosuke Taguchi, Masaaki Koganemaru, Toru Ikeda and Noriyuki Miyazaki .  Development of the singular stress analyses for three-dimensional interfacial corners .  Transaction of JSME83 ( 845 ) 1 - 17   2017.1Development of the singular stress analyses for three-dimensional interfacial cornersReviewed

Toru Ikeda and Kenta Shiba .  Reliable Material Properties of Aluminum Pads with Strong Delamination Toughness in Gold – Aluminum Wire Bonding .  Materials Transactions57 ( 6 ) 860 - 864   2016.4Reliable Material Properties of Aluminum Pads with Strong Delamination Toughness in Gold – Aluminum Wire BondingReviewed

Akiko Ozaki, Toru Ikeda, Shinya Kawahara, Noriyuki Miyazaki, Takuya Hatao, Hiroshi Nakaido and Masaaki Koganemaru .  Development of Analysis Methodrogy to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History .  Journal of Japan Institute of Electronics Packaging18 ( 7 ) 486 - 494   2015.11Development of Analysis Methodrogy to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal HistoryReviewed

Toru Ikeda, Akiko Ozaki, Takuya Hatao and Noriyuki Miyazaki, .  Warpage hysteresis estimation of an electronic package during a thermal cycle .  Proceedings of InterPACK/ICNMM201548168   1 - 8   2015.7Warpage hysteresis estimation of an electronic package during a thermal cycleReviewed

Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki .  Hygromechanical analysis of liquid crystal display panels .  Journal of Electronic Packaging, Trans. ASMEVol. 135 ( No. 4 ) 41005   2013.12Hygromechanical analysis of liquid crystal display panelsReviewed

岡大智，池田徹，宮崎則幸，田中宏之，畑尾卓也，松本圭司，小原さゆり，折井靖光，山田文明，嘉田守宏 .  SEM-DICMによる3次元積層チップの熱ひずみ計測に基づく非線形有限要素解析精度の評価・改善 .  電子情報通信学会論文誌Vol. J96-C ( No.11 ) 352 - 360   2013.11SEM-DICMによる3次元積層チップの熱ひずみ計測に基づく非線形有限要素解析精度の評価・改善Reviewed

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki .  Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs: The inpaacts of stress-induced change of intrinsic carriear density .  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013), 16-18 July 2013 (Burlingame, CA, USA), in CD   IPACK2013-73248   2013.7Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs: The inpaacts of stress-induced change of intrinsic carriear densityReviewed

Toru Ikeda, Masatoshi Oka and Noriyuki Miyazaki .  Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEM .  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013), 16-18 July 2013 (Burlingame, CA, USA), in CD   IPACK2013-73126   2013.7Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEMReviewed

Masaki Nagai, Toru Ikeda, Noriyuki Miyazaki .  Stress Intensity Factor Analyses of Three-Dimensional Interface Cracks using Tetrahedral Finite Elements .  Computational MechanicsVol. 51 ( Issue 5 ) 603 - 615   2013.5Stress Intensity Factor Analyses of Three-Dimensional Interface Cracks using Tetrahedral Finite ElementsReviewed

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki, Kenji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada and Morihiro Kada .  Nonlinear FEA for a 3D SIC Package Improved by the Digital Image Correlation with SEM .  Proceedings of 13th International Symposium on Electronics Packaging (ICEP 2013) in Osaka Japan   22 - 25   2013.4Nonlinear FEA for a 3D SIC Package Improved by the Digital Image Correlation with SEM

Toru Ikeda, Toshifumi Kanno, Nobuyuki Sshishido, Noriyuki Miyazaki, Hiroyuki Tanaka and Takuya Hatao .  Non-Linear Analyses of Strain in Flip Chip Packages Improved by the Measurement using the Digital Image Correlation Method .  Microelectronics ReliabilityVol. 53   145 - 153   2013.1Non-Linear Analyses of Strain in Flip Chip Packages Improved by the Measurement using the Digital Image Correlation MethodReviewed

松田和敏，池田徹，小金丸正明，宮崎則幸 .  樹脂封止された積層半導体チップの残留応力に起因する電気特性変動評価手法 .  日本機械学会論文集 (A編)第79巻 ( 第797号 ) 74 - 88   2013.1樹脂封止された積層半導体チップの残留応力に起因する電気特性変動評価手法Reviewed

松田和敏, 池田 徹, 宮崎則幸 .  パッケージ構成材料に起因するチップ表面の残留応力と反り評価 .  日本機械学会論文集 (A編)78 ( 793 ) 1275 - 1283   2012.10パッケージ構成材料に起因するチップ表面の残留応力と反り評価Reviewed

小金丸正明，吉田圭佑，多田直弘，池田徹，宮崎則幸，友景肇 .  ドリフト拡散デバイスシミュレーションを用いた1軸負荷に起因するnMOSFETの電気特性変動評価手法 .  エレクトロニクス実装学会誌15 ( 6 ) 483 - 491   2012.9ドリフト拡散デバイスシミュレーションを用いた1軸負荷に起因するnMOSFETの電気特性変動評価手法Reviewed

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage .  Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in n-type MOS Devices .  Proceedings of 4th Electronics System Integration technologies Conference (ESTC 2012) in AmsterdamPaper No. PA-P17   2012.9Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in n-type MOS Devices

Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki .  Stress Intensity Factor Analysis of a Three-dimensional Interface Crack between Dissimilar Anisotropic Materials under Thermal Stress .  Engineering Fracture Mechanics91   14 - 36   2012.7Stress Intensity Factor Analysis of a Three-dimensional Interface Crack between Dissimilar Anisotropic Materials under Thermal StressReviewed

Mitsutoshi Abe, Toru Ikeda and Noriyuki Miyazaki .  Stress Singularity Analysis around an Interfacial Corner between Anisotropic Piezoelectric Multi-Materials .  Journal of the Society of Materials Science61 ( 6 ) 522 - 529   2012.6Stress Singularity Analysis around an Interfacial Corner between Anisotropic Piezoelectric Multi-MaterialsReviewed

Hiroshi Hirai,Masatsugu Chiba,Mitsubishi Abe,Toru Ikeda and Noriyuki Miyazaki .  Stress Intensity Factor Analysis Of an Interfacial Corner between Piezoelectric Bimaterials using the H-integral Method .  Engineering Fracture Mechanics82   62 - 72   2012.3Stress Intensity Factor Analysis Of an Interfacial Corner between Piezoelectric Bimaterials using the H-integral Method Reviewed

Toru Ikeda,Toshifumi kanno ， Nobuyuki Shishido,Noriyuki Miyazaki, Hiroyuki Tanaka .  Strain Measurement in Micro-electronic Packages Using Digital Image Correlation Method .  Welding International25   844 - 850   2011.11Strain Measurement in Micro-electronic Packages Using Digital Image Correlation MethodReviewed

Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage .  Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stress on n-Type Silicon Semiconductor Devices, .  IEEE Trans. on Electron Devices58   2525 - 2536   2011.8Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stress on n-Type Silicon Semiconductor Devices, Reviewed

Keisuke Yoshida,Masaaki Koganemaru,Toru IkedaNoriyuki Miyazaki,Hajime Tomokage .  Device Simulation of Packaging-stress Effects of Semiconductor Devices:Evaluation of the Impact of Stress Distribution in the Devices .  Journal of Japan Institute of Electronics Packaging 14 ( 1 ) 45 - 54   2011.1Device Simulation of Packaging-stress Effects of Semiconductor Devices:Evaluation of the Impact of Stress Distribution in the DevicesReviewed

Leslie Banks-Sills, Toru Ikeda .  Stress Intensity Factors for Interface Cracks between Orthotropic and Monoclinic Material .  International Journal of Fracture167   47 - 56   2011.1Stress Intensity Factors for Interface Cracks between Orthotropic and Monoclinic MaterialReviewed

Koichi Horiike, Toru Ikeda, Ryosuke Matsumoto and Noriyuki Miyazaki .  Stress Singularity Analysis at an Interfacial Corner between Dissimilar Crystals and Evaluation of Mixed Modes Fracture Criteria Using Molecular Statics .  Journal of the Society of Materials Science59 ( 12 ) 908 - 915   2010.12Stress Singularity Analysis at an Interfacial Corner between Dissimilar Crystals and Evaluation of Mixed Modes Fracture Criteria Using Molecular StaticsReviewed

Yoshiaki Nomura, Toru Ikeda, Noriyuki Miyazaki .  Stress Intensity Factor Analysis of a Three-Dimensional Interfacial Corner between Anisotropic Bimaterial under Thermal Stress .  International Journal of Solids and Structures47   1775 - 1784   2010.7Stress Intensity Factor Analysis of a Three-Dimensional Interfacial Corner between Anisotropic Bimaterial under Thermal StressReviewed

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage .  Experimental Study of Uniaxial-Stress Effects on DC Characteristics of nMOSFETs .  IEEE Transactions on Components and Packaging Technologies33 ( 2 ) 278 - 286   2010.6Experimental Study of Uniaxial-Stress Effects on DC Characteristics of nMOSFETsReviewed

Younggun Han, Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Woon Choi and Hajime Tomokage .  Influence of Uniaxial Mechanical Stress on the High Frequency Performance of Metal-Oxide-Semiconductor Field Effect Transistors on (100) Si Wafer .  Applied Physics Letters96   213515-1-３   2010.5Influence of Uniaxial Mechanical Stress on the High Frequency Performance of Metal-Oxide-Semiconductor Field Effect Transistors on (100) Si WaferReviewed

Toru Ikeda, Toshifumi Kanno, Nobuyuki Shishido, Noriyuki Miyazaki, Hiroyuki Tanaka and Takuya Hatao .  Strain Measurement in Micro-Electronic Packages using the Digital Image Correlation Method .  Journal of the Japan welding society (in Japanese)79 ( 3 ) 237 - 242   2010.4Strain Measurement in Micro-Electronic Packages using the Digital Image Correlation MethodReviewed

Masaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage .  Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process .  ASME Journal of Electronic Packaging132   011003-1-8   2010.3Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding ProcessReviewed

Kazutoshi Matsuda, Toru Ikeda and Noriyuki Miyazaki .  Prediction of Thermal Deformation of Multi-Layered Substrate, and Its Application to Warpage Analysis of Package .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)76 ( 762 ) 127 - 135   2010.2Prediction of Thermal Deformation of Multi-Layered Substrate, and Its Application to Warpage Analysis of PackageReviewed

asahiro Ueda, Nobuyuki Shishido, Toru Ikeda and Noriyuki Miyazaki .  Effect of Bond Thickness on the Fracture Toughness and the Strain Field around a Crack Tip in Adhesive Joints Using Epoxy Resin Modified with Solid Rubber Particles .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)75 ( 759 ) 1516 - 1525   2009.11Effect of Bond Thickness on the Fracture Toughness and the Strain Field around a Crack Tip in Adhesive Joints Using Epoxy Resin Modified with Solid Rubber ParticlesReviewed

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage .  An Evaluation Method for DC Characteristics Shifts in Resin-Molded nMOSFETs Using Drift-Diffusion Device Simulation .  Journal of Japan Institute of Electronics Packaging (in Japanese)12 ( 3 ) 208 - 220   2009.3An Evaluation Method for DC Characteristics Shifts in Resin-Molded nMOSFETs Using Drift-Diffusion Device SimulationReviewed

Tomonori Mizutani, Toru Ikeda, Kiyoshi Miyake and Noriyuki Miyazaki .  Warpage Analysis in LCD Panel under Moisture Diffusion and Hygroscopic Swelling .  Journal of Japan Institute of Electronics Packaging (in Japanese)12 ( 2 ) 144 - 153   2009.3Warpage Analysis in LCD Panel under Moisture Diffusion and Hygroscopic SwellingReviewed

Yoshiaki Nomura, Toru Ikeda and Noriyuki Miyazaki .  Stress Intensity Factor Analysis at an Interfacial Corner between Anisotropic Bimaterials under Thermal Stress .  Engineering Fracture Mechanics76   221 - 235   2009.1Stress Intensity Factor Analysis at an Interfacial Corner between Anisotropic Bimaterials under Thermal StressReviewed

Masahiro Ueda, Nobuyuki Shishido, Toru Ikeda and Noriyuki Miyazaki .  Measurement and Analyses of the Strain Field around a Crack Tip in Epoxy Resin Modified with Solid Rubber Particles .  Transactions of JSCES (in Japanese)2009   20090007   2009.1Measurement and Analyses of the Strain Field around a Crack Tip in Epoxy Resin Modified with Solid Rubber ParticlesReviewed

Nobuyuki Shishido, Toru Ikeda and Noriyuki Miyazaki .  Strain Measurement in a Microstructure Using Digital Image Correlation for a Laser-scanning Microscopic Image .  Computer Modeling in Engineering & Science (CMES)35 ( 1 ) 1 - 19   2008.12Strain Measurement in a Microstructure Using Digital Image Correlation for a Laser-scanning Microscopic ImageReviewed

Chyanbin Hwu and Toru Ikeda .  Electromechanical Fracture Analysis for Corners and Cracks in Piezoelectric Materials .  International Journal of Solids and Structures45   5744 - 5764   2008.11Electromechanical Fracture Analysis for Corners and Cracks in Piezoelectric MaterialsReviewed

Masaaki Koganemaru, Toru Ikeda and Noriyuki Miyazaki .  Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges .  Microelectronics Reliability48   923 - 932   2008.6Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gaugesReviewed

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage .  Evaluation of DC Characteristics Shifts in Resin-Molded nMOSFETs and Examination of Electron Mobility Model for Stress Effects .  IEICE Transactins on Electronics (in Japanese)J91-C ( 4 ) 257 - 272   2008.4Evaluation of DC Characteristics Shifts in Resin-Molded nMOSFETs and Examination of Electron Mobility Model for Stress EffectsReviewed

Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki .  Stress Singularity Analyses of a Three-Dimensional Interface Crack Between Dissimilar Materials under Thermal stress .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)74 ( 738 ) 240 - 247   2008.2Stress Singularity Analyses of a Three-Dimensional Interface Crack Between Dissimilar Materials under Thermal stressReviewed

Yoshiaki Nomura, Toru Ikeda and Noriyuki Miyazaki .  Stress Singularity Analysis at an Interfacial Corner between Anisotropic Bimaterials under Thermal Stress .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)74 ( 737 ) 37 - 44   2008.1Stress Singularity Analysis at an Interfacial Corner between Anisotropic Bimaterials under Thermal StressReviewed

Nobuyuki Shishido, Toru Ikeda, Noriyuki Miyazaki, Kentaro Nakamura, Masashi Miyazaki and Tatsuro Sawatari .  Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation Method .  Journal of the Society of Materials Science Japan57 ( １ ) 83 - 89   2008.1Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation MethodReviewed

Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki .  Stress Intensity Factor Analysis of an Interface Crack between Dissimilar Anisotropic Materials under Thermal Stress Using the Finite Element Analysis .  International Journal of Fracture146   233 - 248   2007.12Stress Intensity Factor Analysis of an Interface Crack between Dissimilar Anisotropic Materials under Thermal Stress Using the Finite Element AnalysisReviewed

Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki .  Stress intensity factor analysis of a three-dimensional interface crack between dissimilar anisotropic materials .  Engineering Fracture Mechanics74 ( 16 ) 2481 - 2497   2007.11Stress intensity factor analysis of a three-dimensional interface crack between dissimilar anisotropic materialsReviewed

Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki .  Evaluation of the Interfacial Fracture Toughness of Anodic Bonds .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)73 ( 735 ) 1266 - 1272   2007.11Evaluation of the Interfacial Fracture Toughness of Anodic BondsReviewed

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage .  Experimental and Numerical Evaluation of Stress Effects on DC Characteristics of nMOSFETs .  The IEICE Transactions on Electronics (in Japanese)J90-C ( 4 ) 351 - 362   2007.4Experimental and Numerical Evaluation of Stress Effects on DC Characteristics of nMOSFETsReviewed

Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda and Noriyuki Miyazaki .  Application of Meshfree Method to Elastic-Plastic Fracture Mechanics Parameter Analysis .  Computer Modeling in Engineering & Science (CMES)17 ( 2 ) 63 - 72   2007.2Application of Meshfree Method to Elastic-Plastic Fracture Mechanics Parameter AnalysisReviewed

Shuji Takashima, Noriyuki Miyazaki, Toru Ikeda and Michihiko Nakagaki .  Elastic-plastic constitutive equation accounting for microstructure .  Key Engineering Materials340-341   1037 - 1042   2007.1Elastic-plastic constitutive equation accounting for microstructureReviewed

Masaki Nagai, Toru Ikeda and Noriyuki Miyazaki .  Stress Intensity Factors Analyses of Three-Dimensional Interface Crack between Anisotropic Dissimilar Materials .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)72 ( 724 ) 1992 - 1999   2006.12Stress Intensity Factors Analyses of Three-Dimensional Interface Crack between Anisotropic Dissimilar MaterialsReviewed

Toru Ikeda, Masaki Nagai, Koh Yamanaga and Noriyuki Miyazaki .  Stress intensity factor analyses of interface cracks between dissimilar anisotropic materials using the finite element method .  Engineering Fracture Mechanics73   2067 - 2079   2006.9Stress intensity factor analyses of interface cracks between dissimilar anisotropic materials using the finite element methodReviewed

Toru Ikeda, Won-Keun Kim and Noriyuki Miyazaki .  Evaluation of the Delamination in a flip chip using anisotropic conductive adhesive films under moisture/reflow sensitivity test .  IEEE Transactions on components and packaging technologies29 ( 3 ) 551 - 559   2006.9Evaluation of the Delamination in a flip chip using anisotropic conductive adhesive films under moisture/reflow sensitivity testReviewed

Evaluation of Residual Stress in Semiconductor Chips during Resin-Molding Process Using Piezoresistive Test Chips and a Finite Element Analysis Method .  Journal of Japan Institute of Electronics Packaging (in Japanese)9 ( 3 ) 186 - 194   2006.5Evaluation of Residual Stress in Semiconductor Chips during Resin-Molding Process Using Piezoresistive Test Chips and a Finite Element Analysis MethodReviewed

Masaki Nagai, Koh Yamanaga, Toru Ikeda and Noriyuki Miyazaki .  Stress Intensity Factor Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal Stress .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)72 ( 715 ) 285 - 292   2006.3Stress Intensity Factor Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal StressReviewed

Toru Ikeda, Deok-bo Lee and Noriyuki Miyazaki .  Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints and Its Mechanism .  Journal of the Adhesion Society of Japan (in Japanese)42 ( 3 ) 97 - 105   2006.3Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints and Its MechanismReviewed

Won-Keun Kim, Toru Ikeda and Noriyuki Miyazaki .  Analysis of Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Film during Moisture/Reflow Sensitivity Test .  Journal of Japan Institute of Electronics Packaging (in Japanese)8 ( 2 ) 215 - 224   2005.5Analysis of Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Film during Moisture/Reflow Sensitivity TestReviewed

Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda and Noriyuki Miyazaki .  Study of Application of Element-Free Galerkin Method to Dynamic Crack Problem .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)70 ( 691 ) 377 - 382   2004.3Study of Application of Element-Free Galerkin Method to Dynamic Crack ProblemReviewed

Deok-Bo Lee, Toru Ikeda, Noriyuki Miyazaki and Nak-Sam Choi .  Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints .  Trans. ASME, Journal of Engineering Materials and Technology126   14 - 18   2004.1Effect of Bond Thickness on the Fracture Toughness of Adhesive JointsReviewed

Koh Yamanaga, Toru Ikea and Noriyuki Miyazaki .  Stress Intensity Factor Analysis of a Crack on an Interface between Dissimilar Anisotropic Materials .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)69 ( 687 ) 1531 - 1538   2003.11Stress Intensity Factor Analysis of a Crack on an Interface between Dissimilar Anisotropic MaterialsReviewed

Seiya Hagihara, Mitsuyoshi Tunori, Toru Ikeda and Noriyuki Miyazaki .  Element-free Galerkin Method using Directed Grapph and Its Application to Creep Problems .  Computational Mechanics31   489 - 495   2003.9Element-free Galerkin Method using Directed Grapph and Its Application to Creep ProblemsReviewed

Noriyuki Miyazaki, Toru Ikeda and Toshihiro Komura .  Estimation of Steady-State Creep Behavior of Al2O3/YAG Eutectic Composite by Image-Based Finite Element Analysis .  ASME Journal of Engineering Materials and Technology125   277 - 282   2003.7Estimation of Steady-State Creep Behavior of Al2O3/YAG Eutectic Composite by Image-Based Finite Element AnalysisReviewed

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake and Mitsuru Sato .  Strength Evaluation of Plastic Packages during Solder Reflow Process using Stress Intensity Factors of V-Notch .  ASME Journal of Electronic Packaging125   31 - 38   2003.3Strength Evaluation of Plastic Packages during Solder Reflow Process using Stress Intensity Factors of V-NotchReviewed

Won-Keun Kim, Toru Ikeda and Noriyuki Miyazaki .  Evaluation of Reliability of a Joint Using Anisotropic Conductive Adhesive .  Journal of Japan Institute of Electronics Packaging (in Japanese)6 ( 2 ) 153 - 160   2003.3Evaluation of Reliability of a Joint Using Anisotropic Conductive AdhesiveReviewed

Toru Ikea, Junji Mano, Daisuke Ikemoto, Deok-bo Lee and Noriyuki Miyazaki .  Constraint Effect of Adherends on the Fracture of Adhesive Joint (2st Report: Failure Analysis around a Crack Tip Using Gurson Model) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)69 ( 678 ) 434 - 441   2003.2Constraint Effect of Adherends on the Fracture of Adhesive Joint (2st Report: Failure Analysis around a Crack Tip Using Gurson Model)Reviewed

Deok-bo Lee, Toru Ikeda, Noriyuki Miyazaki and Nak-Sam Choi .  Fracture Behavior around a Crack Tip in Rubber-Modified Epoxy Adhesive Joint with Various Bond Thicknesses .  Journal of Materials Science Letters22   229 - 233   2003.2Fracture Behavior around a Crack Tip in Rubber-Modified Epoxy Adhesive Joint with Various Bond ThicknessesReviewed

Noriyuki Miyazaki, Toru Ikeda and Toshihiro Komura .  Estimation of Steady State Creep Behavior of Al2O3/YAG Eutectic Composite by Image-Based Finite Element Analysis .  Journal of the Society of Materials Science Japan (in Japanese)51 ( 11 ) 1242 - 1247   2002.11Estimation of Steady State Creep Behavior of Al2O3/YAG Eutectic Composite by Image-Based Finite Element AnalysisReviewed

Deok-bo Lee, Toru Ikeda, Noriyuki Miyazaki and Nak-Sam Choi .  Damage Zone around Crack Tip and Fracture Toughness of Rubber-Modified Epoxy Resin under Mixed Mode Conditions .  Engineering Fracture Mechanics69 ( 12 ) 1363 - 1375   2002.8Damage Zone around Crack Tip and Fracture Toughness of Rubber-Modified Epoxy Resin under Mixed Mode ConditionsReviewed

Deok-bo Lee, Toru Ikeda, Noriyuki Miyazaki and Nak Sam Choi .  Damage Zone around Tip of an Interface Crack between Rubber-Modified Epoxy Resin and Aluminum .  Trans. ASME Journal of Engineering Materials & Technology124 ( 2 ) 206 - 214   2002.4Damage Zone around Tip of an Interface Crack between Rubber-Modified Epoxy Resin and AluminumReviewed

Deok-bo Lee, Toru Ikea, Noriyuki Miyazaki and Nak-Sam Choi .  Constraint Effect of Adherends on the Fracture of Adhesive Joint (1st Report: Microscopic Obserbation of the Damage Zone around a Crack Tip) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)68 ( 667 ) 86 - 92   2002.2Constraint Effect of Adherends on the Fracture of Adhesive Joint (1st Report: Microscopic Obserbation of the Damage Zone around a Crack Tip)Reviewed

Toru Ikeda and C. T. Sun .  Stress Intensity Factor Analysis for an Interface Crack between Dissimilar Isotropic Materials under Thermal Stress .  International Journal of Fracture111   229 - 249   2001.11Stress Intensity Factor Analysis for an Interface Crack between Dissimilar Isotropic Materials under Thermal StressReviewed

Damage Zone around Crack Tip and Fracture Toughness of Rubber-Modified Epoxy Resin under Mixed Mode Condition .  Journal of the Society of Materials Science Japan (in Japanese)50 ( 1 ) 55 - 61   2001.1Damage Zone around Crack Tip and Fracture Toughness of Rubber-Modified Epoxy Resin under Mixed Mode ConditionReviewed

Yuya Ueno, Toru Ikeda, Noriyuki Miyazaki, Nobutaka Ito .  Design for Plastic Packages of LSI Chips to Prevent Cracking during Solder Reflow Process .  Journal of Japan Institute of Electronics Packaging (in Japanese)4 ( 1 ) 47 - 55   2001.1Design for Plastic Packages of LSI Chips to Prevent Cracking during Solder Reflow ProcessReviewed

Toru Ikeda, Yuji Komohara, Atsuhi Nakamura and Noriyuki Miyazaki .  Kinking out of a Mixed Mode Interface Crack, Fracture and Strength of Solids .  Key Engineering Materials183-1   73 - 78   2000.8Kinking out of a Mixed Mode Interface Crack, Fracture and Strength of SolidsReviewed

Toru Ikeda, Yuji Komohara and Noriyuki Miyazaki .  Delamination Criterion for Interface Cracks in Plastic Packages .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)66 ( 648 ) 1533 - 1540   2000.8Delamination Criterion for Interface Cracks in Plastic PackagesReviewed

Deok bo Lee, Toru Ikeda, Noriyuki Miyazaki .  Damage Zone around Crack Tip for Two-Phase Adhesive Joint with Rubber-Modified Epoxy Resin, (In Case of Lower Fracture Toughness than Bulk Material) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)66 ( 645 ) 939 - 945   2000.5Damage Zone around Crack Tip for Two-Phase Adhesive Joint with Rubber-Modified Epoxy Resin, (In Case of Lower Fracture Toughness than Bulk Material)Invited Reviewed

Toru Ikeda, Yuji Komohara, Atsushi Nakamura and Noriyuki Miyazaki .  Criteria for Fracture and Kinking of Mixed Mode Interface Crack .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)66 ( 644 ) 796 - 803   2000.4Criteria for Fracture and Kinking of Mixed Mode Interface CrackReviewed

Mitsuyoshi Tsunori, Seiya Hagihara, Toru Ikeda, Tomohiro Kido and Noriyuki Miyazaki .  Application of element-free Galerkin method to elastic-plastic problems .  Transactions of JSCES (in Japanese) 20000001   1-6   2000.2Application of element-free Galerkin method to elastic-plastic problemsReviewed

Toru Ikeda, Akira Yamashita, Deok-Bo Lee and Noriyuki Miyazaki .  Strength Evaluation of Electronic Plastic Packages Using Stress Intensity Factors of V-Notch .  Computer Modeling and Simulation in Engineering1 ( 1 ) 80 - 85   2000.1Strength Evaluation of Electronic Plastic Packages Using Stress Intensity Factors of V-NotchReviewed

Toru Ikeda, Akira Yamashita, Deok-Bo Lee and Noriyuki Miyazaki .  Failure of a Ductile Adhesive Layer Constrained by Hard Adherends .  Trans. ASME Journal of Engineering Materials & Technology122-1   80 - 85   2000.1Failure of a Ductile Adhesive Layer Constrained by Hard AdherendsReviewed

Mitsuyoshi Tsunori, Seiya Hagihara, Toru Ikeda, Tomohiro Kido and Noriyuki Miyazaki .  Element-free Galerkin Analysis of Stable Crack Growth Based on Experimental Results .  Transactions of JSCES (in Japanese)19990028   1 - 6   1999.12Element-free Galerkin Analysis of Stable Crack Growth Based on Experimental ResultsReviewed

Isao Arase, Yuya Ueno, Toru Ikeda, Noriyuki Miyazaki, Mami Nagatake, Nobutaka Ito and Mitsuru Sato .  Strength Evaluation of Plastic Packages during Solder Reflow Process .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)65 ( 636 ) 1656 - 1663   1999.8Strength Evaluation of Plastic Packages during Solder Reflow ProcessReviewed

Toru Ikeda, Noriyuki Miyazaki, Kiyoteru Kudo, Kiyoshi Arita and Hideyuki Yakiyama .  Failure Estimation of Semiconductor Chip during Wire Bonding Process .  ASME Journal of Electronic Packaging121   85 - 91   1999.6Failure Estimation of Semiconductor Chip during Wire Bonding ProcessReviewed

Deok bo Lee, Toru Ikeda, Mitsugu Todo, Noriyuki Miyazaki and Kiyoshi Takahashi .  The Mechanism of Damage around Crack Tip in Rubber-Modified Epoxy Resin .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)65 ( 631 ) 439 - 446   1999.3The Mechanism of Damage around Crack Tip in Rubber-Modified Epoxy ResinReviewed

Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda, Tomofumi Shibata, Noriyuki Miyazaki and Michihiko Nakagaki .  Element Free Galerkin Method Using Digraph and Its Application to Creep Nonlinear Problem .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)64 ( 624 ) 2073 - 2079   1998.8Element Free Galerkin Method Using Digraph and Its Application to Creep Nonlinear ProblemReviewed

Toru Ikeda, Akira Yamashita and Noriyuki Miyazaki .  Elastic-Plastic Analysis of Crack in Adhesive Joint by Combination of Boundary Element and Finite Element Methods .  Computational Mechanics21 ( 6 ) 533 - 539   1998.6Elastic-Plastic Analysis of Crack in Adhesive Joint by Combination of Boundary Element and Finite Element MethodsReviewed

Toru Ikeda, Noriyuki Miyazaki and Toshihiro Soda .  Mixed Mode Fracture Criterion of Interface Crack between Dissimilar Materials .  Engineering Fracture Mechanics59 ( 6 ) 725 - 735   1998.4Mixed Mode Fracture Criterion of Interface Crack between Dissimilar MaterialsReviewed

Toru Ikeda, Yuji Komohara and Noriyuki Miyazaki .  Stress Intensity Factor Analysis of an Interface Crack between Dissimilar Materials under Thermal Stress Condition by Virtual Crack Extension Method .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)63 ( 611 ) 1377 - 1384   1997.7 Stress Intensity Factor Analysis of an Interface Crack between Dissimilar Materials under Thermal Stress Condition by Virtual Crack Extension MethodReviewed

Noriyuki Miyazaki, Toru Ikeda and Kenichi Ochi .  Constraint Effect of Clad on Underclad Crack .  ASME Journal of Pressure Vessel and Technology118 ( 3 ) 480 - 483   1996.11Constraint Effect of Clad on Underclad CrackReviewed

Toru Ikeda, Akira Yamashita and Noriyuki Miyazaki .  Elastic-Plastic Analysis of Cracks in Adhesive Joints (Effect of Bond Thickness on Fracture Toughness) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)62 ( 602 ) 2200 - 2206   1996.10Elastic-Plastic Analysis of Cracks in Adhesive Joints (Effect of Bond Thickness on Fracture Toughness)Reviewed

Noriyuki Miyazaki, Toru Ikeda and Takafumi Miyagi .  Dynamic Stress Intensity Factors Analysis of Interface Crack Using Line-Spring Model .  International Journal of Fracture79   393 - 402   1996.7Dynamic Stress Intensity Factors Analysis of Interface Crack Using Line-Spring ModelReviewed

Toru Ikeda, Kiyoteru Kudo, Noriyuki Miyazaki, Tsuyoshi Munakata, Kiyoshi Arita and Hideyuki Yakiyama .  Damage Analysis of Semiconductor Chip during Wire Bonding Process .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)62 ( 595 ) 872 - 877   1996.3Damage Analysis of Semiconductor Chip during Wire Bonding ProcessReviewed

Noriyuki Miyazaki, Toru Ikeda, Ken-ichi Ochi .  Constraint Effect of Crack due to Clad Material .  Journal of The Society of Material Science Japan (in Japanese)45 ( 2 ) 201 - 205   1996.2Constraint Effect of Crack due to Clad MaterialReviewed

Noriyuki Miyazaki, Toru Ikeda .  Dynamic Stress Intensity Factor Analysis of Interface Crack Using Line-Spring Model .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)61 ( 592 ) 2578 - 2583   1995.12Dynamic Stress Intensity Factor Analysis of Interface Crack Using Line-Spring ModelReviewed

Toru Ikeda, Noriyuki Miyazaki, Akira Yamashita and Tsuyoshi Munakata .  Stress Intensity Factor Analyses of an Interface Crack in an Adhesive Joint by Combination of the Boundary Element and Finite Element Methods .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)60 ( 578 ) 2220 - 2227   1994.10Stress Intensity Factor Analyses of an Interface Crack in an Adhesive Joint by Combination of the Boundary Element and Finite Element MethodsReviewed

Noriyuki Miyazaki, Toru Ikeda, Toshihiro Soda, Tsuyoshi Munakata .  Stress Intensity Factor Analysis of Interface Crack using Boundary Element Method (Application of Contour-Integral Method) .  Engineering Fracture Mechanics45 ( 5 ) 599 - 610   1993.5Stress Intensity Factor Analysis of Interface Crack using Boundary Element Method (Application of Contour-Integral Method)Reviewed

Noriyuki Miyazaki, Toru Ikeda, Toshihiro Soda and Tsuyoshi Munakata .  Stress Intensity Factor Analysis of Interface Crack using Boundary Element Method (Application of Virtual Crack Extension Method) .  JSME International Journal (Series A)36 ( 1 ) 36 - 42   1993.1Stress Intensity Factor Analysis of Interface Crack using Boundary Element Method (Application of Virtual Crack Extension Method)Reviewed

Toru Ikeda, Noriyuki Miyazaki, Toshihiro Soda and Tsuyoshi Munakata .  Mixed Mode Fracture Criteria of Interface Crack between Dissimilar Materials .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)58 ( 555 ) 2080 - 2087   1992.11Mixed Mode Fracture Criteria of Interface Crack between Dissimilar MaterialsReviewed

Noriyuki Miyazaki, Toru Ikeda, Toshihiro Soda and Tsuyoshi Munakata .  Stress Intensity Factor Analysis of Interface Crack Using Boundary Element Method (2nd Report, Application of Contour-Integral Method) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)57 ( 544 ) 2903 - 2910   1991.12Stress Intensity Factor Analysis of Interface Crack Using Boundary Element Method (2nd Report, Application of Contour-Integral Method)Reviewed

Noriyuki Miyazaki, Toru Ikeda, Toshihiro Soda and Tsuyoshi Munakata .  Stress Intensity Factor Analysis of Interface Crack Using Boundary Element Method (1st Report, Application of Virtual Crack Extension Method) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)57 ( 551 ) 2063 - 2069   1991.9Stress Intensity Factor Analysis of Interface Crack Using Boundary Element Method (1st Report, Application of Virtual Crack Extension Method)Reviewed

Noriyuki Miyazaki, Toru Ikeda, Kenichi Ito and Tsuyoshi Munakata .  Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods (Application to Axisymmetric Crack Problems) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)57 ( 534 ) 373 - 377   1991.2Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods (Application to Axisymmetric Crack Problems)Reviewed

Noriyuki Miyazaki, Toru Ikeda and Tsuyoshi Munakata .  Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods .  Engineering Fracture Mechanics36 ( 1 ) 61 - 70   1990.1Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element MethodsReviewed

Noriyuki Miyazaki, Toru Ikeda and Tsuyoshi Munakata .  Analysis of Stress Intensity Factor using the Energy Method Combined with the Boundary Element Method .  Computers and Structures33 ( 3 ) 867 - 871   1989.11Analysis of Stress Intensity Factor using the Energy Method Combined with the Boundary Element MethodReviewed

Noriyuki Miyazaki, Toru Ikeda and Tsuyoshi Munakata .  Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods (Application to Mixed-Mode Crack Problems) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)55 ( 513 ) 1180 - 1184   1989.5Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods (Application to Mixed-Mode Crack Problems)Reviewed

Noriyuki Miyazaki, Toru Ikeda and Tsuyoshi Munakata .  Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods (Application to Two-Dimensional Crack Problems) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)55 ( 509 ) 101 - 105   1989.1Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods (Application to Two-Dimensional Crack Problems)Reviewed

Noriyuki Miyazaki, Toru Ikeda, Hideaki Kaneko and Tsuyoshi Munakata .  Analysis of the Stress Intensity Factor Using the Energy Method Combined with the Boundary Element Method (Application to two-dimensional Crack Problems) .  Transactions of the Japan Society of Mechanical Engineers (Series A) (in Japanese)53 ( 492 ) 1590 - 1597   1987.7Analysis of the Stress Intensity Factor Using the Energy Method Combined with the Boundary Element Method (Application to two-dimensional Crack Problems)Reviewed

Noriyuki Miyazaki, Toru Ikeda, Tsuyoshi Munakata .  On the Combination of the Boundary Element Method and Nonlinear Line-Spring Model .  International Journal of Fracture34   R43 - R48   1987.7On the Combination of the Boundary Element Method and Nonlinear Line-Spring ModelReviewed

中川 柊，石井 英敏，池田 徹，小金丸 正明，加々良 剛士   パワーモジュール内部の金属基板・樹脂間における疲労き裂進展挙動の解明  

CMD2023 日本機械学会第36回計算力学講演会 OS-1005  一般社団法人日本機械学会

上野 優真，小金丸 正明，加藤 雅也，宍戸 信之，池田 徹，葉山 裕，萩原 世也，宮崎 則幸   パワーモジュール用ワイヤ接合部の「機械的疲労試験」による寿命評価  

2023(第32回)JIEP修善寺ワークショップ　WS23-1  一般社団法人 エレクトロニクス実装学会 

Toru Ikeda, Hiroaki Yamamoto, Tomoki Kurakazu, Masaaki Koganemaru and Tetsuro Nishimura   Improved Lead-Free Diffusion Bonding Process for Power Devices Utilizing ZnAl Eutectoid Alloy   International conference

The Advanced Technology in Experimental Mechanics and International DIC Society Joint Conference 2023 (ATEM-iDICs '23) 

Masaaki Koganemaru, Masakazu Uchino, Toru Iked   Residual stress measurement in electronic packages by sampling moiré method using X-ray images   International conference

The Advanced Technology in Experimental Mechanics and International DIC Society Joint Conference 2023 (ATEM-iDICs '23) 

池尻 軍馬，池田 徹，小金丸 正明   3次元異方性異種圧電材料接合角部の電界・熱・機械的荷重連成状態での応力拡大係数解析  

日本機械学会M&M2023 材料力学カンファレンス CL0501  一般社団法人日本機械学会

稲田 拓朗，池田 徹，小金丸 正明   分子静力学法を利用した数値実験による，混合モード荷重下における異方性異種材接合角部のき裂等価臨界応力拡大係数の推定  

日本機械学会M&M2023 材料力学カンファレンス CL0505  一般社団法人日本機械学会

TLM Evaluation of Impact of Contact Resistance in Electronic Characteristic Changes of Organic Thin-Film Transistors under Bending Lord   

The Japan Institute of Electronics Packaging 

Fatigue Evaluation by Clap-Hand-Bending in Compressive or Tensile Direction for Ag Wire Used in Organic Electronics   

The Japan Institute of Electronics Packaging 

Evaluation of clap-hand-bending fatigue of pentacene based organic thin-film transistors   

The Japan Institute of Electronics Packaging 

Diffusion Bonding Process and Fatigue Properties of Joints Using ZnAl Eutectoid Alloy  

The Japan Institute of Electronics Packaging 

Toru Ikeda, Shu Nakagawa, Masaaki Koganemaru and Takeshi Kakara   Low cycle fatigue of an interface between a substrate and molding resin in a power module   International conference

ICEP（International Conference on Electronics Packaging）2023 

高橋雄太，池田徹，小金丸正明，加々良剛志，畑尾卓也   パワーデバイス内部の封止樹脂-銅基板界面における 低サイクル疲労き裂進展則  

28th Symposium on “Microjoining and Assembly Technology in Electronics” Mate 2022  スマートプロセス学会 エレクトロニクス生産科学部会 溶接学会 マイクロ接合研究委員会

北嶋柾，宍戸信之，田中友彬，川崎稜登，小金丸正明，池田徹，葉山裕，萩原世也，宮崎則幸   温度制御下の死荷重試験によるパワーモジュール用Alワイヤの高温クリープ特性評価  

28th Symposium on “Microjoining and Assembly Technology in Electronics” Mate 2022  スマートプロセス学会 エレクトロニクス生産科学部会 溶接学会 マイクロ接合研究委員会

弓場敦司，池田徹，小金丸正明，苅谷健人，浮田昌也   高温用鉛はんだの疲労き裂進展挙動  

28th Symposium on “Microjoining and Assembly Technology in Electronics” Mate 2022  スマートプロセス学会 エレクトロニクス生産科学部会 溶接学会 マイクロ接合研究委員会

池田 徹   パワーデバイスにおける、金属と封止樹脂界面の低サイクル疲労強度  

WBG実装コンソーシアム令和3年度第4回会合  大阪大学産業科学研究協会 WBG実装コンソーシアム

塩田 智基，小金丸 正明，松本聡，池田 徹   インパクトイオン化モデルを用いたSOI-nMOSFETの機械的応力効果のデバイスシミュレーション  

CMD2021 日本機械学会第34回計算力学講演会 OS03-225  日本機械学会

池田 徹，中島 倫太郎，小金丸 正明   新型SiC半導体接合部のボイドからのはく離信頼性評価  

CMD2021 日本機械学会第34回計算力学講演会 OS03-189  日本機械学会

弓場 敦司，池田 徹，小金丸 正明，苅谷 健人，浮田 昌也   高温鉛はんだの疲労強度に対する接合プロセスの影響  

CMD2021 日本機械学会第34回計算力学講演会 OS03-199  日本機械学会

加藤 雅也，宍戸 信之，坂口 智紀，小金丸 正明，池田 徹，葉山 裕，萩原 世也，宮崎 則幸   繰り返し4点曲げ試験および熱サイクル試験によるパワーモジュール用アルミワイヤボンド部の疲労き裂進展に伴う非弾性ひずみ振幅の変化  

CMD2021 日本機械学会第34回計算力学講演会 OS03-156  日本機械学会

中島 太聖，小金丸 正明，関根 智仁，宍戸 信之，神谷 庄司，三成 剛生，池田 徹，時任 静士   有機薄膜トランジスタ用Ag配線の1軸引張り負荷による抵抗値変動  

MES2021(第31回マイクロエレクトロニクスシンポジウム) 21A2-2  エレクトロニクス実装学会

田中 裕大，小金丸 正明，宍戸 信之，神谷 庄司，関根 智仁，三成 剛生，池田 徹，時任 静士   有機エレクトロニクス用導電性高分子配線の合掌曲げ疲労評価  

MES2021(第31回マイクロエレクトロニクスシンポジウム) 21A2-3  エレクトロニクス実装学会

高橋 雄太，池田 徹，小金丸 正明，加々良 剛志，畑尾 卓也   パワーデバイス内部の銅基板-封止樹脂界面における疲労き裂進展則の検討  

MES2021(第31回マイクロエレクトロニクスシンポジウム) 21B1-2  エレクトロニクス実装学会

北方 裕梨子，池田 徹，小金丸 正明   接着継ぎ手の破壊強度に及ぼす，接着剤層厚さの影響  

日本機械学会M&M材料力学カンファレンス OS1124  日本機械学会

塩手 大貴，イブラヒム オマール，池田徹，小金丸正明   鋭い3次元接合角部における応力拡大係数の統一的定義  

日本機械学会M&M材料力学カンファレンス OS1127  日本機械学会

大田 真司，鎧 優太，小金丸 正明，池田 徹   異種材接合角部のき裂等価臨界応力拡大係数の推算  

日本機械学会M&M材料力学カンファレンス OS1126  日本機械学会

高橋 雄太，池田 徹，小金丸 正明，加々良 剛志，畑尾 卓也   パワーデバイスにおける金属/樹脂界面き裂の低サイクル疲労き裂進展挙動  

日本機械学会年次大会 J064-03  日本機械学会

北嶋 柾，宍戸 信之，川崎 稜登，田中 友彬，小金丸 正明，池田 徹，葉山 裕，萩原 世也，宮崎 則幸   負荷荷重の異なる死荷重試験とダウンヒルシンプレックス法による パワーモジュール用 Al ワイヤのクリープ特性評価  

日本機械学会年次大会 J064-04  日本機械学会

弓場敦司，苅谷健人，池田 徹，小金丸正明，眞砂紀之，浮田昌也   パワーデバイス用高温鉛はんだの微視的構造と強度の関係  

27th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate 2021)  スマートプロセス学会・溶接学会

中島太聖，中城朋也，小金丸正明，関根智仁，宍戸信之，神谷庄司，三成剛生，池田徹，時任静士   有機薄膜トランジスタの曲げおよび面外圧縮負荷による電気特性変動  

27th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate 2021)  スマートプロセス学会・溶接学会

北嶋柾，宍戸信之，川崎稜登，小金丸正明，池田徹，葉山裕，宮崎則幸   死荷重試験によるパワーモジュール用Alワイヤのクリープ特性評価  

27th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate 2021)  スマートプロセス学会・溶接学会

田中裕大，小金丸正明，神谷庄司，宍戸信之，関根智仁，三成剛生，池田徹，時任静士   有機エレクトロニクス用印刷Ag配線の合掌曲げ疲労評価  

27th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate 2021)  スマートプロセス学会・溶接学会

高橋雄太，長尾元気，池田 徹，小金丸正明，加々良剛志，畑尾卓也   パワーデバイス中の封止樹脂-金属基板界面における低サイクル疲労き裂進展挙動  

27th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate 2021)  スマートプロセス学会・溶接学会

Yuta Abumi, Toru Ikeda and Masaaki Koganemaru   Estimating the stress intensity factors of an interfacial corner between dissimilar materials equivalent to an interfacial crack   International conference

COMPSAFE2020  JSCES・JACM

高橋 雄太，池田 徹，小金丸 正明，長尾 元気, 加々良　剛志，畑尾 卓也   パワーデバイス内部の封止樹脂-金属基板接合部における疲労き裂進展挙動の解明  

CMD2020計力スクウェア研究報告集  日本機械学会計算力部門

坂口智紀，宍戸信之，小金丸正明，池田徹，葉山裕，萩原世也，宮崎則幸   パワーモジュール用アルミワイヤボンド部の4点曲げ試験のシミュレーション  

CMD2020計力スクウェア研究報告集  日本機械学会計算力部門

北方 裕梨子，池田 徹，小金丸 正明   接着継ぎ手における接着剤層厚さと見かけの接着継ぎ手強度の関係  

CMD2020計力スクウェア研究報告集  日本機械学会計算力部門

イブラヒム　オマール，池田　徹，小金丸　正明   完全な三次元接合角部における応力拡大係数の検討  

CMD2020計力スクウェア研究報告集  日本機械学会計算力部門

鐙 優太，池田 徹,小金丸 正明   分子静力学法および結合力モデルを用いた異方性異種材界面角部のき裂等価応力拡大係数の推定  

CMD2020計力スクウェア研究報告集  日本機械学会計算力部門

池田　徹   接着継ぎ手における接着剤層厚さが継ぎ手の強度に与える影響について   Invited

日本接着学会西部支部設立記念講演会  日本接着学会　

池田　徹，長尾　元気，小金丸　正明，加々良　剛志，畑尾　卓也   パワーモジュールにおける封止樹脂と基板の熱疲労と機械的疲労によるはく離進展挙動  

日本機械学会年次大会  日本機械学会

日髙功二，小金丸正明，関根智仁，宍戸信之，神谷庄司，三成剛生，池田徹，時任静士   薄膜有機トランジスタ用ゲート絶縁層の機械的負荷下での絶縁性能評価  

第30回マイクロエレクトロニクスシンポジウム (MES2020)  エレクトロニクス実装学会

塩塚航生，塩田智基，小金丸正明，松本聡，池田徹，宮崎則幸   SOI?MOSデバイスにおける機械的応力効果の実験的評価  

第30回マイクロエレクトロニクスシンポジウム (MES2021)  エレクトロニクス実装学会

弓場　敦司，松尾　朋郎，池部　旭，池田　徹，小金丸　正明，苅谷　健人，眞砂　紀之,　浮田　昌也   パワーデバイス用高温鉛はんだにおける接合プロセスと強度の関係  

第30回マイクロエレクトロニクスシンポジウム (MES2020)  エレクトロニクス実装学会

坂口 智紀, 宍戸 信之, 山下 聡真，小金丸 正明，池田 徹，葉山 裕，宮崎 則幸   4点曲げを用いたパワーモジュール用アルミワイヤボンドの疲労試験  

Mate2020 

Toru Ikeda, Yutaka Kinose, Yuji Koga and Masaaki Koganemaru Kagoshima University   Analyses of Unified Fracture Parameters Describing the Singular Stress Around a Jointed Sharp 3D Interfacial Corner between Dissimilar Anisotropic Materials under Mechanical and Thermal Stress   International conference

APCOM 2019  APCOM 2019

小金丸 正明, 大迫 徹, 瀬戸口 慶樹, 宍戸 信之，池田 徹，葉山 裕，宮崎 則幸   パワーモジュール用ワイヤボンド接合部の熱疲労寿命評価に関する研究   Invited

溶接学会第128回マイクロ接合研究委員会  溶接学会第128回マイクロ接合研究委員会

池田　徹，川下　隼介，七蔵司　優斗，小金丸　正明，鹿児島大学，外薗　洋昭，浅井竜彦，富士電機株式会社   パワーモジュールにおける熱サイクル試験時の封止樹脂のはく離予測評価  

令和元年度学術講演会  スマートプロセス学会

中島 倫太郎, 城ノ下 航, 定松 直, 小金丸 正明, 池田 徹   ナノスケールにおける異種材界面上のミスフィット転位周りの応力場評価  

日本機械学会M&M2019 材料力学カンファレンス  日本機械学会

鐙 優太, 木之瀬 優考, 小金丸 正明, 池田 徹   分子静力学法を用いた異方性異種材界面角部の等価き裂強度の推定  

日本機械学会M&M2019 材料力学カンファレンス  日本機械学会

Toru Ikeda, Takumi Sasaki, Atsushi Yanase, Dai Okumura, Yoshiharu Kariya, Masaaki Koganemaru   Strain distribution in a small solder specimen with few crystal grains   International conference

ASME 2019 InterPACK, 10/9/2019  ASME 2019 InterPACK, 10/9/2019

Masaaki Koganemaru, Sho Nagato, Toru Ikeda, Masakazu Uchino   Application of x-ray CT images and phase-shifted sampling moire method to residual strain measurement in electronic packages   International conference

ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (ASME 2019 INTERPACK)  ASME 2019 INTERPACK

加々良 剛志, 中井戸 宙, 畑尾 卓也, 長尾 元気, 小金丸 正明, 池田 徹   パワーデバイス用封止樹脂の熱サイクル試験におけるはく離信頼性評価解析  

日本機械学会第32回計算力学講演会（CMD2019）  日本機械学会

塩塚 航生, 日高 和也, 小金丸 正 明, 松本 聡, 池田 徹, 宮崎 則幸   SOI-MOSデバイスの寄生バイポーラ領域における機械的応力効果のデバイスシミュレーション  

日本機械学会第32回計算力学講演会（CMD2019）  日本機械学会

長尾 元気, 池田 徹, 小 金丸 正明, 加々良 剛志, 中井戸 宙, 畑尾 卓也   パワーモジュール中における熱サイクル疲労と機械的疲労下での封止樹脂一金属基板界面き裂の進展挙動  

日本機械学会第32回計算力学講演会（CMD2019）  日本機械学会

大迫 徹, 瀬戸口 慶樹, 宍戸 信之, 小金丸 正明, 池田 徹, 葉山 裕, 宮崎 則幸   パワーモジュール用ワイヤボンド部の熱疲労寿命評価指標の検討  

日本機械学会第32回計算力学講演会（CMD2019）  日本機械学会

池田 徹，佐々木　拓海，小金丸　正明，柳瀬　篤志，奥村　大，苅谷　義治   微小スズ試験片の結晶粒中のひずみ計測と結晶塑性理論による解析  

日本機械学会年次大会  日本機械学会

日髙 功二，中城 朋也，小金丸 正明，宍戸 信之，関根 智仁，神谷 庄司，池田徹   繰り返し引張り負荷による印刷有機薄膜トランジスタの電気特性変動  

エレクトロニクス実装学会　MES2019  エレクトロニクス実装学会

中城 朋也，小金丸 正明，宍戸 信之，関根 智仁，神谷 庄司，池田 徹   円形試験片を用いた1軸引張り負荷下での印刷有機薄膜トランジスタの電気特性変動評価  

MES2019  エレクトロニクス実装学会

池田　徹   接着継ぎ手強度に与える，接着剤厚さの影響について   Invited

日本接着学会　研究会合同シンポジウム  日本接着学会　

Toru Ikeda, Takumi Sasaki, Atsushi Yanase, Dai Okumura, Yoshiharu Kariya and Masaaki Koganemaru   Experimental and numerical studies of strain distribution in a small Sn structure with few crystal grains   International conference

ICCES 2019  ICCES 2019

池田徹, 長尾元気, 小金丸正明, 加々良剛志, 中井戸宙, 畑尾卓也   パワーモジュールにおける樹脂と金属の熱サイクル疲労寿命の予測  

Mate 2019  Mate 2019

木之瀬優孝，池田徹，小金丸正明   三次元異方性異種材界面角部と二次元異方性異種材界面角部における特異性応力場の互換性の検証  

日本機械学会M&M2018材料力学カンファレンス  日本機械学会M&M2018材料力学カンファレンス

城ノ下航，定松直，小金丸正明，池田徹   ナノスケールにおけるミスフィット転位が存在する異種材界面近傍の応力場評価  

日本機械学会M&M2018材料力学カンファレンス  日本機械学会M&M2018材料力学カンファレンス

池田徹   接着強度に与える接着剤層厚さの影響に関する考察   Invited

第2回接着・接合研究シンポジウム  第2回接着・接合研究シンポジウム

佐々木拓海，奥村大，苅谷義治，小金丸正明，池田徹   数結晶よりなる微細すず試験片のひずみ測定と有限要素法を用いた結晶塑性解析  

日本機械学会第31回計算力学講演会  日本機械学会第31回計算力学講演会

長尾元気，井上　航太朗，池田徹，小金丸　正明，加々良　剛志，中井戸　宙，畑尾　卓也   パワーモジュール内の封止樹脂と金属基板界面の熱サイクル疲労はく離強度と機械的疲労はく離強度の比較検討  

日本機械学会第31回計算力学講演会  日本機械学会第31回計算力学講演会

日高和也，小金丸正明，池田徹，松本聡，宮崎則幸   SOI-MOSデバイスの機械的応力に起因する電気特性変動シミュレーション  

日本機械学会　第31回計算力学講演会  日本機械学会　第31回計算力学講演会

瀬戸口慶樹，宍戸信之，小金丸正明，池田徹，葉山祐，宮崎則幸   遷移クリープ挙動を考慮したパワーモジュール用アルミワイヤ接合部の熱疲労解析  

日本機械学会　第31回計算力学講演会  日本機械学会　第31回計算力学講演会

池田　徹，学　井上　航太朗，学　長尾　元気，正　小金丸　正明，中井戸　宙，畑尾　卓也   パワーモジュールの樹脂と金属部品のはく離防止設計法の向上による，省エネ・創エネへの貢献  

日本機械学会九州支部北九州大会  日本機械学会九州支部北九州大会

池田　徹，井上　航太朗，小金丸　正明，畑尾　卓也，中井戸　宙，加々良　剛志   パワーモジュールにおける樹脂と金属の疲労破壊強度評価  

日本機械学会2018年度年次大会  日本機械学会2018年度年次大会

池田 徹，井上 航太朗，長尾 元気，小金丸 正明，中井戸 宙，畑尾 卓也   パワーモジュールにおける樹脂-金属界面の熱サイクル疲労はく離強度の機械的疲労試験による予測  

エレクトロニクス実装学会 MES2018  エレクトロニクス実装学会 MES2018

中城朋也，小金丸正明，宍戸信之，関根智仁，神谷庄司，池田徹   1軸引張り負荷下での印刷有機薄膜トランジスタの電気特性評価  

MES2018  MES2018

笹川宗太郎，宍戸信之，小金丸正明，関根智仁，神谷庄司，池田徹   ポリパラキシレンの機械的特性と引張り負荷下での絶縁特性の評価  

MES2018  MES2018

小金丸正明，鈴木航太，日高和也，池田徹，松本聡，宮崎則幸   SOI-nMOSFETの機械的応力に起因する電気特性変動  

日本機械学会2018年度年次大会  日本機械学会2018年度年次大会

小金丸正明，日高和也，池田徹，松本聡，宮崎則幸   4点曲げ負荷下でのSOIパワーMOSFETのDC特性評価  

日本機械学会九州支部 北九州講演会  日本機械学会九州支部 北九州講演会

瀬戸口 慶樹，宍戸信之，小金丸正明，池田徹，葉 山裕，宮崎則幸   応力緩和試験によるパワーモジュール用アルミワイヤのクリープ特性評価  

日本機械学会九州支部 北九州講演会  本機械学会九州支部 北九州講演会

Masaaki Koganemaru, Kazuya Hidaka, Toru Ikeda, Noriyuki Miyazaki   Experimental and Numerical Study of Uniaxial-Stress Effects on DC Characteristics of pMOSFETs   International conference

7th Electronics System Integration Technology Conference 2018 (ESTC 2018) in Dresden  7th Electronics System Integration Technology Conference 2018 (ESTC 2018) in Dresden

Ｔoru Ikeda, Yutaka Kinose, Yuji Koga, Masaaki Koganemaru   Analysis of asymptotic solution around a jointed sharp 3D interfacial corner between dissimilar anisotropic materials under thermal stress   International conference

The 11th International Conference on Fracture and Strength of Solids  The 11th International Conference on Fracture and Strength of Solids

池田 徹，井上 航太朗，長尾 元気，小金丸 正明，中井戸 宙，畑尾 卓也   パワーモジュールにおける樹脂-金属界面の熱サイクル疲労はく離強度と機械的疲労はく離強度の比較検討  

2018マイクロエレクトロニクスショー  2018マイクロエレクトロニクスショー

池田徹, 川下隼介, 七藏司優斗, 小金丸 正明, 外薗洋昭, 浅井竜彦   ハ゜ワーモシ゛ュールにおける熱サイクル試 験時の封止樹脂のはく離予測評価  

第24回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム  スマートプロセス学会、溶接学会

池田　徹   エレクトロニクスパッケージングにおける信頼性評価技術   Invited

JTM九州セミナー　【環境試験の基礎と最新試験動向】  日本試験機工業会

池田　徹   数結晶よりなる微細すす゛試験片内のひす゛み測定と結晶塑性理論を用いた解析の比較   Invited

第20回　CAE活用事例セミナー  エムエスシーソフトウェア株式会社

城ノ下航，芝健太，定松直，小金丸正明，池田徹   ナノスケールにおけるSi-Ge 界面近傍のひずみ・応力場評価  

日本機械学会M&M材料力学カンファレンス 

木之瀬優孝，古賀裕二，池田徹，小金丸正明   H-integral による熱応力下の三次元接合角部のスカラーパラメーター解析  

日本機械学会M&M材料力学カンファレンス 

池田徹,柳瀬篤志,佐々木拓海,小金丸正明,奥村大,苅谷義治   結晶異方性を考慮した数結晶よりなるスズ試験片のひずみ計測と解析  

日本機械学会2017年度年次大会 

金丸正明,松本光気,内野正和,池田徹   サンプリングモアレ法を用いた樹脂封止半導体チップのひずみ計測  

日本機械学会2017年度年次大会 

日高和也，小金丸正明，池田徹，宮崎則幸   1軸負荷に起因したpMOSFETの電気特性変動デバイスシミュレーション  

日本機械学会第30回計算力学講演会 

佐々木拓海，柳瀬篤志，奥村大，苅谷義治，小金丸正明，池田徹   数結晶粒よりなる微細すず試験片のひずみ測定と有限要素法を用いた変形挙動解析  

日本機械学会第30回計算力学講演会 

瀬戸口慶樹，宍戸信之，須崎雄一，小金丸正明， 池田徹，葉山祐，宮崎則幸   パワーモジュール用アルミワイヤボンドの熱弾塑性クリー プ解析  

日本機械学会第30回計算力学講演会 

井上航太朗，池田徹，小金丸正明，畑尾卓也，中井戸宙   パワーモジュール内における高耐熱封止樹脂のはく離強度評価  

日本機械学会第30回計算力学講演会 

川下隼介，七藏司優斗，池田徹，小金丸正明，外薗洋昭，浅井竜彦   パワーモジュールの非線形熱応力解析による樹脂と金属部品のはく離予測  

日本機械学会第30回計算力学講演会 

七藏司優斗，川下隼介，池田徹，小金丸正明，外薗洋昭，浅井竜彦   パワーモジュール中の銅基板・アルミ冷却器と封止樹脂のはく離強度評価  

日本機械学会第30回計算力学講演会 

M. Koganemaru, K. Hidaka, T. Ikeda, N. Miyazaki   Evaluation of Uniaxial-Stress Effects on DC Characteristics of P-Type MOSFETs   International conference

19th International Conference on Electronics Materials and Packaging (EMAP2011)  

S. Kawashita, Y. Nanazoshi, T. Ikeda, M. Koganemaru, H. Hokazono, T. Asai   Evaluation of the delamination between metallic components and encapsulation resin in a power module during thermal cycle tests   International conference

19th International Conference on Electronics Materials and Packaging (EMAP2011)  

Y. Nanazoshi, S. Kawashita, T. Ikeda, M. Koganemaru, H. Hokazono, T. Asai   Evaluation of the delimitation toughness between metallic components and encapsulation resin in a power module under wide temperature   International conference

19th International Conference on Electronics Materials and Packaging (EMAP2011)  

七藏司優斗，川下隼介，池田徹，小金丸正明，外薗洋昭，浅井竜彦   パワーモジュール中の銅基板・アルミ冷却器と封止樹脂のはく離強度評価  

日本機械学会第30回計算力学講演会 

井上航太朗，池田徹，小金丸正明，畑尾卓也，中井戸宙   パワーモジュール内における高耐熱封止樹脂のはく離強度評価  

日本機械学会第30回計算力学講演会 

瀬戸口慶樹，宍戸信之，須崎雄一，小金丸正明， 池田徹，葉山祐，宮崎則幸   パワーモジュール用アルミワイヤボンドの熱弾塑性クリー プ解析  

日本機械学会第30回計算力学講演会 

佐々木拓海，柳瀬篤志，奥村大，苅谷義治，小金丸正明，池田徹   数結晶粒よりなる微細すず試験片のひずみ測定と有限要素法を用いた変形挙動解析  

日本機械学会第30回計算力学講演会 

日高和也，小金丸正明，池田徹，宮崎則幸   1軸負荷に起因したpMOSFETの電気特性変動デバイスシミュレーション  

日本機械学会第30回計算力学講演会 

池田徹,柳瀬篤志,佐々木拓海,小金丸正明,奥村大,苅谷義治   結晶異方性を考慮した数結晶よりなるスズ試験片のひずみ計測と解析  

日本機械学会2017年度年次大会 

井上航太朗，池田徹，小金丸正明，中井戸宙，畑尾卓也   パワーモジュール用高耐熱封止樹脂のはく離強度評価  

エレクトロニクス実装学会MES2017 

笹川宗太郎，宍戸信之，小金丸正明，関根智仁，池田徹，神谷庄司   印刷有機デバイス用ポリパラキシレンの引張特性  

エレクトロニクス実装学会MES2017 

小金丸正明，松本光気，内野正和，池田徹   電子パッケージのひずみ計測への位相シフトサンプリングモアレ法の適用  

エレクトロニクス実装学会MES2017 

古賀裕二，池田徹   三次元接合角部の特異性応力場解析手法の開発  

日本機械学会九州支部第69期総会講演会  日本機械学会九州支部

柳瀬篤志，池田徹   数結晶粒よりなる微細スズ試験片の変形挙動解析  

日本機械学会九州支部第69期総会講演会講演論文集  日本機械学会九州支部

川下隼介，池田徹   パワーデバイスの非線形応力解析  

日本機械学会九州支部第47回卒業研究発表講演会  日本機械学会九州支部

池田徹，星子純輝，河野務   ポアソン比を考慮した半導体実装部の粘弾性解析とデジタル画像相関法によるひずみ分布の検証  

第30回エレクトロニクス実装学会春季講演大会  エレクトロニクス実装学会

Toru Ikeda and Akiko Ozaki   Simulation of the warpage hysteresis of a layered electronic package during a thermal cycle   Invited International conference

Bio4Apps 2015 

新谷寛，池田徹，広佐古晃，谷江尚史   圧縮応力場におけるはんだ接合部の変形挙動の測定  

M&M2015 材料力学カンファレンス  日本機械学会材料力学部門

古賀裕二，池田徹   三次元接合角部のスカラーパラメーター解析手法の精度改善  

M&M2015 材料力学カンファレンス  日本機械学会材料力学部門

柳瀬 篤志，池田 徹，苅谷 義治   数結晶よりなるスズ微細試験片内のひずみ測定  

日本機械学会第28回計算力学講演会  日本機械学会計算力学部門

尾崎秋子，池田 徹，中井戸 宙，畑尾 卓也   パワーデバイス用樹脂と金属基板のはく離強度評価  

日本機械学会第28回計算力学講演会  日本機械学会計算力学部門

芝 健太，池田 徹，中野 景介，草間 竜一   ワイヤボンディング強度に及ぼすアルミパッドの特性評価  

日本機械学会第28回計算力学講演会  日本機械学会計算力学部門

池田　徹，柳瀬　篤志，宮崎　則幸   数結晶よりなる錫微小試験片の変形機構の解明  

日本機械学会2015年度年次大会  日本機械学会

Toru Ikeda, Kenta Shiba, Keisuke Nakano and Ryuichi Kusama   Evaluation of the reliable material properties of Al pads that have strong delamination toughness of Au/Al wire bonding   International conference

EMAP2015  EMAP2015

Toru Ikeda, Akiko Ozaki, Takuya Hatao and Noriyuki Miyazaki,   Warpage hysteresis estimation of an electronic package during a thermal cycle   International conference

InterPACK/ICNMM2015  ASME

中井戸 宙, 畑尾 卓也, 山下 勝志, 尾崎 佑衣, 池田 徹, 尾崎 秋子   異種材界面における高耐熱樹脂のはく離評価解析  

日本機械学会第27回計算力学講演会  日本機械学会第27回計算力学講演会

尾崎 秋子, 池田 徹, 畑尾 卓也, 中井戸 宙   熱履歴による物性変化を考慮した模擬PoPパッケージの反りヒステリシス解析  

日本機械学会第27回計算力学講演会  日本機械学会第27回計算力学講演会

池田 徹, 尾崎 秋子, 寺元 祐貴, 宮崎 則幸, 畑尾 卓也   パワーデバイスにおける封止樹脂と基板の界面はく離強度評価  

日本機械学会第27回計算力学講演会  日本機械学会第27回計算力学講演会

Toru Ikeda, Akiko Ozaki, Hiroshi Nakaido, Takuya Hatao and Noriyuki Miyazaki   Warpage analyses of a package on package considering the change of visco-elastic material properties of resin during thermal history   International conference

EMAP2014  EMAP2014

池田 徹，尾崎秋子，寺元祐貴，宮崎則幸, 畑尾卓也   パワーデバイスにおける封止樹脂のはく離評価  

日本機械学会2014年度年次大会  日本機械学会2014年度年次大会

池田 徹，尾崎秋子，畑尾卓也，中井戸宙   粘弾性物性の熱履歴を考慮した電子パッケージの反りヒステリシス解析  

エレクトロニクス実装学会 MES2014  エレクトロニクス実装学会 MES2014

Toru Ikeda, Takashi Tokuda, Yosuke Taguchi and Noriyuki Miyazaki   Singular stress analysis of sharp three-dimensional interfacial corner of jointed dissimilar materials using H-integral   International conference

11th World Congress on Computational Mechanics (WCCM XI)  11th World Congress on Computational Mechanics (WCCM XI)

Toru Ikeda, Yosuke Taguchi and Noriyuki Miyazaki   Stress singularity analysis of three-dimensional interfacial corner of jointed dissimilar materials   International conference

Computational engineering and science for safety and environmental problems (COMPSAFE2014)  Computational engineering and science for safety and environmental problems (COMPSAFE2014)

尾崎秋子, 河原真哉, 池田徹, 宮崎則幸, 畑尾卓也   熱履歴を考慮した電子パッケージの反りヒステリシス解析  

日本機械学会九州支部第67期総会・講演会  日本機械学会九州支部第67期総会・講演会

Toru Ikeda, Mitsutoshi Abe, Noriyuki Miyazaki   Stress Intensity Factor Analysis of a Three-dimensional Interfacial Corner of Boned Anisotropic Piezoelectric Materials   International conference

APCOM & ISCM 2013: 5th Asia Pacific Congress on Computational Mechanics & 4th International Symposium on Computational Mechnics  APCOM & ISCM 2013: 5th Asia Pacific Congress on Computational Mechanics & 4th International Symposium on Computational Mechnics

森山真樹，松本龍介，池田徹，宮崎則幸   異方性弾性論を用いたミスフィット転位が存在する 異種材界面近傍の応力場評価  

日本材料学会 第8回関西支部若手シンポジウム  日本材料学会 第8回関西支部若手シンポジウム

坂本大輔, They Kuan Chung, 池田徹, 宮崎則幸,   マイクロはんだ接合部における数結晶粒よりなるβ-錫構造体の変形機構の評価  

日本機械学会 計算力学講演会  日本機械学会 計算力学講演会

森山真樹，松本龍介，池田徹，宮崎則幸   異種材界面におけるミスフィット転位による応力場の解析  

日本機械学会 Μ&Μ材料力学カンファレンス  日本機械学会 Μ&Μ材料力学カンファレンス

池田徹，田口陽介，宮崎則幸   H-integtal による三次元異方性異種接合角部のスカラーパラメーターの解析  

日本機械学会 Μ&Μ材料力学カンファレンス  日本機械学会 Μ&Μ材料力学カンファレンス

Toru Ikeda, Shinya Kawahara, Noriyuki Miyazaki, Takuya Hatao   Warpage Analyses of a Stacked Package Considering the Change of Visco-elastic Material Properties of Resin during Thermal History   International conference

The 15th International Conference on Electronic Materials and Packaging / The 12th International Symposium on Microelectronics and Packaging (EMAP/ISMP 2013)  The 15th International Conference on Electronic Materials and Packaging / The 12th International Symposium on Microelectronics and Packaging (EMAP/ISMP 2013)

池田徹, 田口陽介, 宮崎則幸   三次元異方性異種材接合角部の特異応力場解析  

日本機械学会九州支部 鹿児島講演会  日本機械学会九州支部 鹿児島講演会

池田 徹，河原真哉，宮崎則幸，畑尾卓也   熱履歴を受ける樹脂の粘弾性特性変動を考慮した積層パッケージの反り解析  

第23回マイクロエレクトロニクスシンポジウム(MES2013)  第23回マイクロエレクトロニクスシンポジウム(MES2013)

池田徹，河原真哉，宮崎則幸，畑尾卓也   熱履歴による樹脂の粘弾性物性変化を考慮した積層パッケージの反り予測解析  

日本機械学会 2013年度年次大会  日本機械学会 2013年度年次大会

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda   Noriyuki Miyazaki, Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs: The inpaacts of stress-induced change of intrinsic carriear density   International conference

The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)

Toru Ikeda, Masatoshi Oka and Noriyuki Miyazaki   Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEM   International conference

The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)  The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)

Toru Ikeda, Masatashi Oka, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada and Morihiro Kada   Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM   International conference

International Conference on Electronics Packaging in Osaka, ICEP2013  International Conference on Electronics Packaging in Osaka, ICEP2013

河原真哉，池田 徹，宮崎則幸，畑尾卓也   熱負荷による粘弾性物性変化を考慮した積層体の反り予測有限要素解析精度の向上  

日本機械学会九州支部第66期総会講演会  日本機械学会九州支部第66期総会講演会

岡大智，池田徹，宮崎則幸，松本圭司，小原さゆり，折井靖光，山田文明，嘉田守弘   SEMとデジタル画像相関法を組み合わせた熱ひずみ計測を用いた三次元積層チップの微細接合部の信頼性評価  

19th Symposium on “Microjoining and Assembly Technology in Electronics”, Mate2013  19th Symposium on “Microjoining and Assembly Technology in Electronics”, Mate2013

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki, Hiroyuki Tanaka, Takuya Hatao   Reliability Evaluation of a New 3D SIC Package by FEM and Thermal -Strain Measurement with Digital Image Correlation Using SEM   International conference

The 14tth International Conference on Electronic Meterials and Packaging (EMAP 2012)  The 14tth International Conference on Electronic Meterials and Packaging (EMAP 2012)

池田 徹   デジタル画像相関法を用いたひずみ計測による微細電子実装部の非線形有限要素法の精度改善  

Marc Users Meeting 2012 in Fukuoka  Marc Users Meeting 2012 in Fukuoka

小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇   nMOSFET 内部の応力分布と電気特性との相関に関するデバイスシミュレーション  

日本機械学会第25回計算力学講演会  日本機械学会第25回計算力学講演会

森山真樹, 池田 徹, 宮崎則幸   異方性異種圧電材料接合角部の破壊靭性評価  

日本機械学会第25回計算力学講演会  日本機械学会第25回計算力学講演会

Naohiro Tada, Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage   Numerical Evaluation of Correlation between Stress Concentration and Electronic Characteristics on nMOSFETs   International conference

International Computational Mechanics Symposium 2012 (ICMS2012)  International Computational Mechanics Symposium 2012 (ICMS2012)

Masatoshi Oka, Shinya Kawahara, Toru Ikeda, Noriyuki Miyazaki, Hiroyuki Tanaka and Takuya Hatao   Improvement of the Accuracy of Nonlinear Finite Element Analysis for a 3D SIC Package Using SEM and DICM   International conference

International Computational Mechanics Symposium 2012 (ICMS2012)  International Computational Mechanics Symposium 2012 (ICMS2012)

松田 和敏, 池田 徹, 宮崎則幸, 小金丸正明   樹脂封止された積層半導体チップの残留応力に起因する電気特性変動評価  

日本機械学会第25回計算力学講演会  日本機械学会第25回計算力学講演会

池田 徹, 岡大智, 宮崎則幸, 田中宏之, 畑尾卓也   SEM-DICM を用いた3D-SIC 模擬チップのひずみ計測と有限要素解析精度の向上  

日本機械学会第25回計算力学講演会  日本機械学会第25回計算力学講演会

岡 大智, 河原真哉,池田 徹, 宮崎 則幸, 松本圭二, 小原さゆり, 折井靖光, 山田文明, 嘉田守弘   SEMとデジタル画像相関法によるひずみ計測を利用した三次元積層チップの非線形有限要素解析の精度向上  

第22回マイクロエレクトロニクスシンポジウム (MES2012)  第22回マイクロエレクトロニクスシンポジウム (MES2012)

岡 大智, 池田 徹, 宮崎則幸，松本圭司, 小原さゆり, 折井靖光, 山田文明, 嘉田守弘   SEMを用いたデジタル画像相関法による熱ひずみ計測を用いた三次元積層チップの非線形有限要素解析精度評価  

日本機械学会M&M2012材料力学カンファレンス  日本機械学会M&M2012材料力学カンファレンス

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage   Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in n-type MOS Devices   International conference

4th Electronics System Integration technologies Conference (ESTC 2012)  4th Electronics System Integration technologies Conference (ESTC 2012)

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage   Device Simulation of Stress Effect on Electrical Performances of Semiconductor Devices : Impact of Mechanical Stress in the Region of High Current Density in the Devices   International conference

10th World Congress on Computational Mechanics  10th World Congress on Computational Mechanics

Toru IKEDA, Mitsutosi Abe and Noriyuki MIYAZAKI   Stress Intensity Factor Analysis of a Three-Dimensional Interfacial Corner Jointed Anisotropic Piezoelectric Materials   International conference

10th World Congress on Computational Mechanics  10th World Congress on Computational Mechanics

Noriyuki MIYAZAKI, Toru IKEDA and Masatoshi OKA   Improvement of Nonlinear Finite Element Analyses of Electronic Packaging Using the Strain Measurement with the Digital Image Correlation   International conference

10th World Congress on Computational Mechanics  10th World Congress on Computational Mechanics

池田・デンソー共同研究

2014.4 - 2016.3

民間企業  国内共同研究 

池田　徹、池田 徹

池田・日立日立研究所共同研究

2014.4 - 2015.3

共同研究費  国内共同研究 

池田 徹