論文 - 西川 健二郎
-
I. Toyoda, K. Nishikawa, K. Kamogawa, C. Yamaguchi, M. Hirano, K. Onodera, and T. Tokumitsu . X-band Si Bipolar Transistor Single-chip Transceiver Using Three-dimensional MMIC Technology . 1998 IEEE Radio Frequency Integrated Circuits Symp. Dig. 289 - 292 1998年6月査読
-
K. Nishikawa, K. Kamogawa, K. Inoue, K. Onodera, M. Hirano, T. Tokumitsu, and I. Toyoda . Millimeter-wave Three-dimensional Masterslice MMICs . 1998 IEEE MTT-S Int. Microwave Symp. Dig. 313 - 316 1998年6月査読
-
K. Nishikawa, I. Toyoda, K. Kamogawa, and T. Tokumitsu . Three-Dimensional Silicon MMIC's Operating up to K-band . IEEE Trans. Microwave Theory Tech.Vol. 46 ( No. 5 ) 677 - 684 1998年5月査読
-
K. Nishikawa, I. Toyoda, K. Kamogawa, T. Tokumitsu, C. Yamaguchi, and M. Hirano . K-Band Si MMIC Amplifier and Mixer using Three-Dimensional Masterslice MMIC Technology . 1998 IEEE Int. Solid-State Circuits Conf., Digest of Technical Papers 252 - 253 1998年2月査読
-
M. Nakatsugawa, A. Kanda, H. Okazaki, K. Nishikawa, and M. Muraguchi . Line-Loss and Size Reduction Techniques for Millimeter-Wave RF Front-End Boards by Using a Polyimide/Almina-Ceramic Multilayer Configuration . IEEE Trans. Microwave Theory Tech.Vol. 45 ( No. 12 ) 2308 - 2315 1997年12月査読
-
I. Toyoda, K. Nishikawa, T. Tokumitsu, K. Kamogawa, C. Yamaguchi, M. Hirano and M. Aikawa . Three-Dimensional Masterslice MMIC on Si Substrate . IEEE Trans. Microwave Theory Tech.Vol.45 ( No.12 ) 2524 - 2529 1997年12月査読
-
K. Kamogawa, K. Nishikawa, C. Yamaguchi, M. Hirano, I. Toyoda and T. Tokumitsu . Wide-Tuning Range Si Bipolar VCO's Based on Three-Dimensional MMIC Technology . IEEE Trans. Microwave Theory Tech.Vol.45 ( No.12 ) 2436 - 2442 1997年12月査読
-
T. Tokumitsu, K. Nishikawa, K. Kamogawa, I. Toyoda and K. Nishimura . Three-Dimensional MMIC Technology and Application to Millimeter-Wave MMIC's . 1997 IEEE Topical Symp. Millimeter Waves Dig. 97 - 100 1997年11月査読
-
M. Hirano, K. Nishikawa, I. Toyoda, S. Aoyama, S. Sugitani and K. Yamasaki . Three-Dimensional Interconnect Technology for Ultra-Compact MMICs . Solid-State ElectronicsVol.41 ( No.10 ) 1451 - 1455 1997年10月査読
-
T. Tokumitsu, M. Hirano, K. Yamasaki, C. Yamaguchi, K. Nishikawa and M. Aikawa . Highly Integrated Three-Dimensional MMIC Technology Applied to Novel Masterslice GaAs- and Si-MMIC's . IEEE Journal of Solid-State CircuitsVol.32 ( No.9 ) 1334 - 1341 1997年10月査読
-
K. Nishikawa, I. Toyoda and T. Tokumitsu . Miniaturized Three-Dimensional MMIC K-Band Upconverter . IEEE Microwave and Guided Wave LettersVol.7 ( No.8 ) 230 - 232 1997年8月査読
-
M. Nakatsugawa, A. Kanda, H. Okazaki, K. Nishikawa, and M. Muraguchi . Line-Loss and Size Reduction Techniques for Millimeter-Wave RF Front-End Boards by Using a Polyimide/Almina-Ceramic Multilayer Configuration . 1997 IEEE MTT-S Int. Microwave Symp. Dig. 509 - 512 1997年5月査読
-
I. Toyoda, K. Nishikawa, T. Tokumitsu, K. Kamogawa, C. Yamaguchi, M. Hirano and M. Aikawa . Three-Dimensional Masterslice MMIC on Si Substrate . 1997 IEEE Radio Frequency Integrated Circuits Symp. Dig. 113 - 116 1997年5月査読
-
K. Kamogawa, K. Nishikawa, C. Yamaguchi, M. Hirano, I. Toyoda and T. Tokumitsu . A Very Wide-Tuning Range 5-GHz-Band Si Bipolar VCO Using Three-Dimensional MMIC Technology . 1997 IEEE MTT-S Int. Microwave Symp. Dig. 1221 - 1224 1997年5月査読
-
K. Onodera, M. Hirano, M. Tokumitsu, I. Toyoda, K. Nishikawa and T. Tokumitsu . Folded U-Shaped Microwire Technology for Ultra-Compact Three-Dimensional MMIC's . IEEE Trans. Microwave Theory Tech.Vol.44 ( No.12 ) 2347 - 2353 1996年12月査読
-
K. Nishikawa, T. Tokumitsu and I. Toyodawa . Miniaturized Wilkinson Power Divider Using Three-Dimensional MMIC Technology . IEEE Microwave and Guided Wave LettersVol.6 ( No.10 ) 372 - 374 1996年10月査読
-
M. Aikawa, T. Tokumitsu and K. Nishikawa . Advanced MMIC Technology for The Next Generation-3D MMICs and Master-Slice Technology (Invited paper) . 1996 European Microwave Conf. Proc. 748 - 753 1996年10月査読
-
K. Nishikawa, K. Kamogawa, T. Tokumitsu, M. Aikawa, M. Hirano and S. Sugitani . Highly-Integrated Three-Dimensional MMIC 20-GHz Single Chip Receiver . 1996 European Microwave Conf. Proc. 199 - 203 1996年10月査読
-
M. Hirano, K. Nishikawa, I. Toyoda, S. Aoyama, S. Sugitani and K. Yamasaki . 3-D Interconnect Technology for Ultra-Compact MMICs . 1996 Topical Workshop on Heterostructure Microelectronics Proc. 18 - 19 1996年8月査読
-
T. Tokumitsu, K. Nishikawa, K. Kamogawa, I. Toyoda and M. Aikawa . Three-Dimensional MMIC Technology for Multifunction Integration and Its Possible Application to Masterslice MMIC . 1996 IEEE Microwave and Millimeter-Wave Monolithic Circuits Symp., Dig. 85 - 88 1996年6月査読